materials

Kester Components

Arrow Technologies distributes Tacky Soldering Fluxes, Wafer Bumping Solder Paste, Reflow Encapsulants and Capillary Underfills, and Ultra Spheres for Kester. Kester is a leading global supplier of higher performance interconnecting materials and related services for the electronic and micro-component assembly markets.

• Tacky Soldering Fluxes (TSF)
• Trajectory planning
• For Flip Chip or Chip Attach Application (FCA) and Ball or Spheres Attach Application (BA)
• Available in both Water Soluble and Rosin (no clean)
• Wafer Bumping Solder Paste
• Designed for Substrates, Wafer Bumping and Ultra low-pitch Bumping Applications
• Available in Sn63 / Pb37, Lead Free Alloys, Low Alpha and Ultra Low Alpha Solder Alloys
• Reflow Encapsulants And Capillary Underfills
• Single Pass Flip Chip on Rigid Board with low voiding
• Available in Single Pass Reflow Encapsulants and Conventional Capillary Underfill
• Ultra Spheres
• Kester's Ultra Spheres are smooth, clean surfaces and tight size distribution, together with excellence resistance to darkening and exceptional solderability
• Available in various sizes and alloys